ADS8342

SBAS277 – MAY 2003

www.ti.com

3

PACKAGE DISSIPATION RATINGS

BOARD

PACKAGE

R

ΘJC

(

°C/W)

R

ΘJA

(

°C/W)

DERATING FACTOR

ABOVE TA ≤ +25°C

(mW/

°C)

TA ≤ +25°C

POWER RATING

(mW)

TA ≤ +70°C

POWER RATING

(mW)

TA = +85°C

POWER RATING

(mW)

Low K

PFB

19.6

97.5

10.256

1282

820

666

High K

PFB

19.6

63.7

15.698

1962

1255

1020

(1) The JEDEC Low K(1s) board design used to derive this data was a 3 inch x 3 inch, 2-layer board with 2-ounce copper traces on top of the board.

(2) The JEDEC High K(2s2p) board design used to derive this data was a 3 inch x 3 inch, multilayer board with 1-ounce internal power and ground

planes and 2-ounce copper traces on the top and bottom of the board.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

Supply voltage, +AVDD to AGND

4.75

5

5.25

V

Supply voltage, –AVDD to AGND

–5.25

–5

–4.75

V

Supply voltage BV

to BGND

Low-voltage levels

2.7

3.6

V

Supply voltage, BVDD to BGND

5V logic levels

4.5

+DVDD

V

Supply voltage, +DVDD to DGND

4.75

5

5.25

V

Supply voltage, –DVDD to DGND

–5.25

–5

–4.75

V

Reference input voltage

2.0

2.5

2.55

V

Analog input voltage

–REFIN

+REFIN

V

Common voltage

–0.3

0

+0.3

V

Ground differences, AGND to REFGND or BGND or DGND

–0.01

0

0.01

V

Voltage differences, +DVDD to +AVDD and –DVDD to –AVDD

–0.01

0

0.01

V

EQUIVALENT INPUT CIRCUIT