SN65LVDS93A-Q1 datasheet(5/35 Pages) TI1

5 / 35 page

SN65LVDS93A-Q1

www.ti.com

SLLSEM1B – FEBRUARY 2015 – REVISED APRIL 2015

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Supply voltage range, VCC, IOVCC, LVDSVCC, PLLVCC(2)

–0.5

Voltage range at any output terminal

–0.5

VCC + 0.5

Voltage range at any input terminal

–0.5

IOVCC + 0.5

Continuous power dissipation

See Thermal Information

Storage temperature, Tstg

–65

150

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

All voltages are with respect to the GND terminals.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per AEC Q200-002(1)

±4000

V(ESD)

Electrostatic discharge

Charged-device model (CDM), per AEC Q100-011

±1500

(1)

AEC Q200-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

PARAMETER

MIN

NOM

MAX

UNIT

Supply voltage, VCC

3.3

3.6

LVDS output Supply voltage, LVDSVCC

3.3

3.6

PLL analog supply voltage, PLLVCC

3.3

3.6

IO input reference supply voltage, IOVCC

1.62

1.8 / 2.5 / 3.3

3.6

Power supply noise on any VCC terminal

0.1

IOVCC = 1.8 V

IOVCC/2 + 0.3 V

High-level input voltage, VIH

IOVCC = 2.5 V

IOVCC/2 + 0.4 V

IOVCC = 3.3 V

IOVCC/2 + 0.5 V

IOVCC = 1.8 V

IOVCC/2 - 0.3 V

Low-level input voltage, VIL

IOVCC = 2.5 V

IOVCC/2 - 0.4 V

IOVCC = 3.3 V

IOVCC/2 - 0.5 V

Differential load impedance, ZL

132

Ω

Operating free-air temperature, TA

–40

°C

Virtual junction temperature, TJ

105

°C

6.4 Thermal Information

DGG

THERMAL METRIC(1)

UNIT

56 PINS

RθJA

Junction-to-ambient thermal resistance

63.4

RθJC(top)

Junction-to-case (top) thermal resistance

15.9

RθJB

Junction-to-board thermal resistance

32.5

°C/W

ψJT

Junction-to-top characterization parameter

0.4

ψJB

Junction-to-board characterization parameter

32.2

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Submit Documentation Feedback

Product Folder Links: SN65LVDS93A-Q1

SN65LVDS93A-Q1 bảng dữ liệu(PDF) 5 Page - Texas Instruments

SN65LVDS93A-Q1 bảng dữ liệu(HTML) 5 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35

bảng dữ liệu tải về

Link URL