LM26LVCISD-080SLASHNOPB datasheet(3/33 Pages) TI1

3 / 33 page

VDD

GND

VSENSE

GND

VDD

GND

VDD

GND

1 PA

LM26LV

www.ti.com

SNIS144F – JULY 2007 – REVISED FEBRUARY 2013

Pin Descriptions

Name

Type

Equivalent Circuit

Description

No.

TRIP TEST pin. Active High input.

If TRIP TEST = 0 (Default) then:

VTEMP = VTS, Temperature Sensor Output Voltage

TRIP

Digital

If TRIP TEST = 1 then:

TEST

Input

OVERTEMP and OVERTEMP outputs are asserted and

VTEMP = VTRIP, Temperature Trip Voltage.

This pin may be left open if not used.

Over Temperature Switch output

Active High, Push-Pull

Digital

OVERTEMP

Asserted when the measured temperature exceeds the Trip Point

Output

Temperature or if TRIP TEST = 1

This pin may be left open if not used.

Over Temperature Switch output

Active Low, Open-drain (See Determining the Pull-up Resistor Value)

Digital

OVERTEMP

Asserted when the measured temperature exceeds the Trip Point

Output

Temperature or if TRIP TEST = 1

This pin may be left open if not used.

VTEMP Analog Voltage Output

If TRIP TEST = 0 then

Analog

VTEMP = VTS, Temperature Sensor Output Voltage

VTEMP

Output

If TRIP TEST = 1 then

VTEMP = VTRIP, Temperature Trip Voltage

This pin may be left open if not used.

VDD

Power

Positive Supply Voltage

GND

Ground

Power Supply Ground

The best thermal conductivity between the device and the PCB is achieved

by soldering the DAP of the package to the thermal pad on the PCB. The

DAP

Die Attach Pad

thermal pad can be a floating node. However, for improved noise immunity

the thermal pad should be connected to the circuit GND node, preferably

directly to pin 2 (GND) of the device.

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