SN74LVC1G66DBVT datasheet(2/17 Pages) TI

2 / 17 page

SN74LVC1G66

SINGLE BILATERAL ANALOG SWITCH

SCES323H − JUNE 2001 − REVISED SEPTEMBER 2003

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

description/ordering information (continued)

NanoStar

 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for

analog-to-digital and digital-to-analog conversion systems.

FUNCTION TABLE

CONTROL

INPUT

(C)

SWITCH

OFF

logic diagram (positive logic)

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†

Supply voltage range, VCC (see Note 1)

−0.5 V to 6.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range, VI (see Notes 1 and 2)

−0.5 V to 6.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Switch I/O voltage range, VI/O (see Notes 1, 2, and 3)

−0.5 V to VCC + 0.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . .

Control input clamp current, IIK (VI < 0)

−50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

I/O port diode current, IIOK (VI/O < 0 or VI/O > VCC)

±50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

On-state switch current, IT (VI/O = 0 to VCC)

±50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous current through VCC or GND

±100 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

θJA (see Note 4): DBV package

206

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DCK package

252

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

YEA/YZA package

154

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . .

YEP/YZP package

132

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. All voltages are with respect to ground, unless otherwise specified.

2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

3. This value is limited to 5.5 V maximum.

4. The package thermal impedance is calculated in accordance with JESD 51-7.

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