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công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
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công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
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SN74LVC1G66DBVT bảng dữ liệu(PDF) 1 Page - Texas Instruments |
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SN74LVC1G66DBVT bảng dữ liệu(HTML) 1 Page - Texas Instruments |
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1 / 17 page  SN74LVC1G66 SINGLE BILATERAL ANALOG SWITCH SCES323H − JUNE 2001 − REVISED SEPTEMBER 2003 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Available in the Texas Instruments NanoStar and NanoFree Packages D 1.65-V to 5.5-V VCC Operation D Inputs Accept Voltages to 5.5 V D Max tpd of 0.8 ns at 3.3 V D High On-Off Output Voltage Ratio D High Degree of Linearity D High Speed, Typically 0.5 ns (VCC = 3 V, CL = 50 pF) D Low On-State Resistance, Typically ≈5.5 Ω (VCC = 4.5 V) D Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II D ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) description/ordering information This single analog switch is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of up to 5.5 V (peak) to be transmitted in either direction. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING‡ NanoStar − WCSP (DSBGA) 0.17-mm Small Bump − YEA SN74LVC1G66YEAR −40 °C to 85°C NanoFree − WCSP (DSBGA) 0.17-mm Small Bump − YZA (Pb-free) Reel of 3000 SN74LVC1G66YZAR _ _ _C6_ −40 °C to 85°C NanoStar − WCSP (DSBGA) 0.23-mm Large Bump − YEP Reel of 3000 SN74LVC1G66YEPR _ _ _C6_ NanoFree − WCSP (DSBGA) 0.23-mm Large Bump − YZP (Pb-free) SN74LVC1G66YZPR SOT (SOT-23) − DBV Reel of 3000 SN74LVC1G66DBVR C66_ −40 °C to 85°C SOT (SOT-23) − DBV Reel of 250 SN74LVC1G66DBVT C66_ −40 °C to 85°C SOT (SC-70) − DCK Reel of 3000 SN74LVC1G66DCKR C6_ SOT (SC-70) − DCK Reel of 250 SN74LVC1G66DCKT C6_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). DBV OR DCK PACKAGE (TOP VIEW) 1 2 3 5 4 A B GND VCC C 3 2 1 4 5 GND B A C VCC YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) Copyright 2003, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar and NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
Số phần tương tự - SN74LVC1G66DBVT |
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Mô tả tương tự - SN74LVC1G66DBVT |
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