STM32L162VD datasheet(53/115 Pages) STMICROELECTRONICS

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STM32L162VD-X

Electrical characteristics

107

6.3

Operating conditions

6.3.1

General operating conditions

5. A positive injection is induced by VIN > VDD while a negative injection is induced by VIN < VSS. IINJ(PIN) must never be

exceeded. Refer to Table 9: Voltage characteristics for the maximum allowed input voltage values.

6. When several inputs are submitted to a current injection, the maximum

ΣIINJ(PIN) is the absolute sum of the positive and

negative injected currents (instantaneous values).

Table 11. Thermal characteristics

Symbol

Ratings

Value

Unit

TSTG

Storage temperature range

–65 to +150

°C

Maximum junction temperature

150

°C

Table 12. General operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

fHCLK Internal AHB clock frequency

MHz

fPCLK1 Internal APB1 clock frequency

fPCLK2 Internal APB2 clock frequency

VDD

Standard operating voltage

BOR detector disabled

1.65

3.6

BOR detector enabled, at

power on

1.8

3.6

BOR detector disabled, after

power on

1.65

3.6

VDDA(1)

Analog operating voltage

(ADC and DAC not used)

Must be the same voltage as

VDD(2)

1.65

3.6

Analog operating voltage

(ADC or DAC used)

1.8

3.6

VIN

I/O input voltage

FT pins; 2.0 V

≤VDD

-0.3

5.5(3)

FT pins; VDD < 2.0 V

-0.3

5.25(3)

BOOT0 pin

5.5

Any other pin

-0.3

VDD+0.3

Power dissipation at TA = 85 °C for

suffix 6 or TA = 105 °C for suffix 7(4)

WLCSP104 package

435

Ambient temperature for 6 suffix version Maximum power dissipation(5)

–40

°C

Ambient temperature for 7 suffix version Maximum power dissipation

–40

105

Junction temperature range

6 suffix version

–40

105

°C

7 suffix version

–40

110

1. When the ADC is used, refer to Table 54: ADC characteristics.

2. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV between VDD and

VDDA can be tolerated during power-up .

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