TS3USB221

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SCDS220I – NOVEMBER 2006 – REVISED JANUARY 2016

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation, see the following:

•

High Speed Layout Guidelines, SCAA082

•

USB 2.0 Board Design and Layout Guidelines, SPRAAR7

12.2 Trademarks

MIPI is a trademark of Mobile Industry Processor Interface Alliance.

All other trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

12.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Copyright © 2006–2016, Texas Instruments Incorporated

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Product Folder Links: TS3USB221