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L7292D bảng dữ liệu(PDF) 56 Page - STMicroelectronics

tên linh kiện L7292D
Giải thích chi tiết về linh kiện  Five buck regulators power management unit
PDF  60 Pages
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
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L7292D bảng dữ liệu(HTML) 56 Page - STMicroelectronics

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PCB design rules guideline
L7292
56/60
DocID028601 Rev 1
13.4
General rules
Do not share vias. Every component connecting to the power or the reference plane
needs its own via.
For large currents multiple vias are to be preferred.
Vias shall be placed as close as possible to the component pin.
Feedback nodes are sensitive. Keep them away from magnetic fields and nodes that
may capacitive couple energy into them.
13.5
Thermal aspects
The device package uses the center pad as a thermal conduit. This pad should be
connected to an adequate spread of copper. When following the suggested layer stack the
internal ground plane may be sufficient. If lots of other heat generating components are
close by it may be necessary to create an exposed copper area on the backside of the
board. The pad should be connected using multiple vias.



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