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LMP92066PWPR bảng dữ liệu(PDF) 7 Page - Texas Instruments

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LMP92066
www.ti.com
SNAS634B – MARCH 2014 – REVISED JANUARY 2016
Electrical Characteristics (continued)
Unless otherwise noted: VDD = 5 V ±5%, VIO = 1.8 V to 3.3 V, TA = 25°C. VDDB = 5 V ±5%, VSSB = GNDA, VDACx output
range 0 V to 5 V; or VDDB = GNDA, VSSB = –5 V ±5%, VDACx output range 0 V to –5V. DAC input code range 48 to 4047.
VDACX load CL = 10 µF.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
EEPROM
Maximum EEPROM write cycles
100
DIGITAL INPUT CHARACTERISTICS (DRVEN0, DRVEN1, SDA, and SCL)
0.7 ×
VIH
Input high voltage
–25°C < TA < 120°C
VIO
0.3 ×
VIL
Input low voltage
–25°C < TA < 120°C
V
VIO
0.2 ×
Hysteresis
VIO
CiND
Input capacitance
5
pF
DIGITAL INPUT CHARACTERISTICS (A0, A1)
0.7 ×
VIH
Input high voltage
–25°C < TA < 120°C
VIO
V
0.3 ×
VIL
Input low voltage
–25°C < TA < 120°C
VIO
RUP
Internal pullup resistance
17
k
Ω
RDN
Internal pulldown resistance
17
Max external capacitance(5)
30
pF
DIGITAL OUTPUT CHARACTERISTICS (SDA)
IOUT = 4 mA, –25°C < TA < 120°C
0.4
VOL
Output low voltage
V
IOUT = 4 mA
0.16
Current from the supply rail through the
Open-drain output leakage current with
ILEAK
pullup resistor into the drain of the open-
±1
μA
output high(5)
drain output device, –25°C < TA < 120°C
COUT
Output capacitance
4
pF
SUPPLY CURRENT SPECIFICATIONS
Normal operation(6),(7) –25°C < TA < 120°C
2.6
While executing EEPROM BURN(8)
4
IDD
mA
While transferring EEPROM content to
9
operating memory(9)
I2C inactive, –25°C < TA < 120°C
3
IVIO
µA
I2C in fast mode, –25°C < TA < 120°C
3.1
IVDDB
LDMOS mode, RL = ∞, –25°C < TA < 120°C
1.5
mA
IVSSB
GaN mode, RL = ∞, –25°C < TA < 120°C
–1.4
PWR
Power consumption, conversion mode
All output pins RL = ∞
20
mW
(Conv)
(6)
The normal operation current through the VDD excludes the current supplied to the external load, and excludes the current required by
the EPPROM BURNS and TRANSFERS.
(7)
The power supply must be capable of sourcing a minimum of 50mA in order to avoid the continuous activation of the LMP92066’s
power-on-reset (POR) circuit.
(8)
During the EEPROM BURN command execution the device activates internal systems that are not active during the Normal operation.
This causes a momentary increase in supply current through the VDD pin. The duration of this temporary surge in supply current is
typically 125 ms.
(9)
During the data transfer from the EEPROM to the Operating memory there will be a momentary surge in supply current through the VDD
pin. The duration of this surge is typically 200 µs.
Copyright © 2014–2016, Texas Instruments Incorporated
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