Analog Integrated Circuit Device Data



41

Freescale Semiconductor

BC3770

6.1.2.7

Bill of Materials

Figure 22 shows a typical connection diagram with an application processor on the mobile system. The following table lists the external

components for this diagram.

Table 6. Bill of Materials (23)

Item

Qty

Schematic Label

Value

Description (L x W in mm)

Part Number

Assy

Opt

1

1

VBUS

2.2

F

1.0 x 0.5 or 1.6 x 0.8, 10 V or higher,

X5R, ceramic capacitor

2

1

PMID

2.2

F

1.6 x 0.8 x 1.0, 10 V or higher, X5R,

ceramic capacitor

3

1

VL

1.0

F

1.0 x 0.5, 10 V or higher, X5R, ceramic

capacitor

4

1

CHGOUT

4.7

F

1.6 x 0.8, 10 V or higher, X5R, ceramic

capacitor

5

1

VSYS

10

F

1.6 x 0.8, 10 V or higher, X5R, ceramic

capacitor

6

1

LX

1.0

H

2.05 x 1.65, CIGT inductor in the

recommended table recommended

7

1

BOOT

22 nF

1.0 x 0.5, 10 V, X5R, ceramic

capacitor

8

1

NOBAT

100 k



0.6 x 0.3, a pull-down resistor to

connect to 1.8 V VDD ADC Input

9

1

INTB

200 k



0.6 x 0.3, a Pull-up resistor to system



I/O voltage rail, VIO

10

1

SDA

2.2 k

 or

1.5 k



1.0 x 0.5, a Pull-Up resistor to system

I/O voltage rail, VIO

11

1

SCL

2.2 k

 or

1.5 k



1.0 x 0.5, a Pull-Up resistor to system

I/O voltage rail, VIO

Notes

23.

Freescale does not assume liability, endorse, or warrant components from external manufacturers are referenced in circuit drawings or tables.

While Freescale offers component recommendations in this configuration, it is the customer’s responsibility to validate their application.

24.

Do not populate

25.

Critical components. For critical components, it is vital to use the manufacturer listed.