TDC-GP22 datasheet(21/93 Pages) AMSCO

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Ultrasonic-Flow-Converter

TDC-GP22

2-14

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Maximum temperature

The maximum temperature requirement for the resin surface, given 260ºC as the peak

temperature of the package body’s surface, is that the resin surface temperature must

not exceed 250ºC for more than 10 seconds. This temperature should be kept as low as

possible to reduce the load caused by thermal stress on the package, which is why

soldering for short periods only is recommended. In addition to using a suitable

temperature profile, we also recommend that you check carefully to confirm good

soldering results.

Date Code: YYWWA: YY = Year, WW = week, A = Assembly site code

2.6

Power Supply

Supply voltage

TDC-GP22 is a high end mixed analog/digital device. To reach full performance of the chip

a good power supply is mandatory. It should be high capacitive and of low inductance.

The TDC-GP22 provides two pairs of power supply terminals:

Vio

- I/O supply voltage

Vcc

- Core supply voltage

Figure 2-10

Both voltages should be applied with low series resistance from the same source. On the

chip there are connected, but a separate external connection is recommended for good

measurement quality. All ground pins should be connected to a ground plane on the

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TDC-GP22 bảng dữ liệu(PDF) 21 Page - ams AG