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MTP52N06VL bảng dữ liệu(PDF) 2 Page - ON Semiconductor

tên linh kiện MTP52N06VL
Giải thích chi tiết về linh kiện  N?묬hannel Power MOSFET
PDF  7 Pages
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nhà sản xuất  ONSEMI [ON Semiconductor]
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ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
(Cpk ≥ 2.0) (Note 3)
(VGS = 0 Vdc, ID = .25 mAdc)
Temperature Coefficient (Positive)
V(BR)DSS
60
−
−
65
−
−
Vdc
mV/°C
Zero Gate Voltage Drain Current
(VDS = 60 Vdc, VGS = 0 Vdc)
(VDS = 60 Vdc, VGS = 0 Vdc, TJ = 150°C)
IDSS
−
−
−
−
10
100
mAdc
Gate−Body Leakage Current (VGS = ± 15 Vdc, VDS = 0 Vdc)
IGSS
−
−
100
nAdc
ON CHARACTERISTICS (Note 1)
Gate Threshold Voltage
(Cpk ≥ 2.0) (Note 3)
(VDS = VGS, ID = 250 mAdc)
Threshold Temperature Coefficient (Negative)
VGS(th)
1.0
−
1.5
4.5
2.0
−
Vdc
mV/°C
Static Drain−to−Source On−Resistance
(Cpk ≥ 2.0) (Note 3)
(VGS = 5 Vdc, ID = 26 Adc)
RDS(on)
−
0.022
0.025
W
Drain−to−Source On−Voltage
(VGS = 5 Vdc, ID = 52 Adc)
(VGS = 5 Vdc, ID = 26 Adc, TJ = 150°C)
VDS(on)
−
−
−
−
1.6
1.4
Vdc
Forward Transconductance (VDS = 6.3 Vdc, ID = 20 Adc)
gFS
17
30
−
Mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc, f = 1.0 MHz)
Ciss
−
1900
2660
pF
Output Capacitance
Coss
−
550
770
Transfer Capacitance
Crss
−
170
340
SWITCHING CHARACTERISTICS (Note 2)
Turn−On Delay Time
(VDD = 30 Vdc, ID = 52 Adc,
VGS = 5 Vdc, RG = 9.1 W)
td(on)
−
15
30
ns
Rise Time
tr
−
500
1000
Turn−Off Delay Time
td(off)
−
100
200
Fall Time
tf
−
200
400
Gate Charge (See Figure 8)
(VDS = 48 Vdc, ID = 52 Adc, VGS = 5 Vdc)
QT
−
62
90
nC
Q1
−
4.0
−
Q2
−
31
−
Q3
−
16
−
SOURCE−DRAIN DIODE CHARACTERISTICS
Forward On−Voltage
(IS = 52 Adc, VGS = 0 Vdc)
(IS = 52 Adc, VGS = 0 Vdc,
TJ = 150 °C)
VSD
−
−
1.03
0.9
1.5
−
Vdc
Reverse Recovery Time
(IS = 52 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/ms)
trr
−
104
−
ns
ta
−
63
−
tb
−
41
−
Reverse Recovery Stored Charge
QRR
−
0.28
−
mC
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from contact screw on tab to center of die)
(Measured from the drain lead 0.25″ from package to center of die)
LD
−
−
3.5
4.5
−
−
nH
Internal Source Inductance
(Measured from the source lead 0.25″ from package to source bond pad)
LS
−
7.5
−
nH
1. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.
2. Switching characteristics are independent of operating junction temperature.
3. Reflects typical values.
Cpk =
Max limit − Typ
3 x SIGMA



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