PIC17C752-08SLASHCL datasheet(281/328 Pages) MICROCHIP

281 / 328 page

DS30289A-page 281

PIC17C7XX

22.1

Package Marking Information

68/84-Lead PLCC

AABBCDE

Example

64-Lead TQFP

MMMMMMMMMM

AABBCDE

MMMMMMMMMM

Example

9817CAE

68/84-Lead CERQUAD Windowed

Example

PIC17C756A

-08/L

9848CAE

MMMMMMMMMMMMMMMMM

AABBCDE

PIC17C756-04/CL

9850CAE

-08I/PT

PIC17C752

Legend: MM...M

Microchip part number information

XX...X

Customer speciﬁc information*

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Facility code of the plant at which wafer is manufactured

O = Outside Vendor

C = 5” Line

S = 6” Line

H = 8” Line

Mask revision number

Assembly code of the plant or country of origin in which

part was assembled

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line thus limiting the number of available characters

for customer speciﬁc information.

Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask

rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with

your Microchip Sales Ofﬁce. For QTP devices, any special marking adders are included in QTP price.

80-Lead TQFP

MMMMMMMMMMMM

AABBCDE

MMMMMMMMMMMM

Example

9817CAE

-08I/PT

PIC17C752

MMMMMMMMMM

MMMMMMMMMMMMMMMMM

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