2.7Gbps, Low-Power SFP Laser Drivers

16

______________________________________________________________________________________

Bonding Coordinates

*Index pad. Orient the die with this pad in the lower-left corner.

**Bond out both pairs of OUT- and OUT+ to minimize series

inductance.

Chip Information

TRANSISTOR COUNT: 327

SUBSTRATE CONNECTED TO GND

DIE SIZE: 60 mils x 79 mils

PROCESS: SiGe Bipolar

Table 5. MAX3735 Bondpad Locations

COORDINATES

PAD

NAME

XY

1*

BC_MON

47

47

2

PC_MON

47

229

47

514

4

IN-

47

696

5

IN+

47

878

47

1063

7

GND

242

1149

8

TX_DISABLE

452

1149

9

APCSET

636

1149

10

GND

819

1149

11

APCFILT2

1008

1149

12

APCFILT1

1193

1149

13

MD

1383

1149

14

GND

1567

1149

15

1758

1032

16**

OUT-

1758

888

17**

OUT-

1758

742

18**

OUT+

1758

579

19**

OUT+

1758

433

20

1758

289

21

BIAS

1758

93

22

GND

1578

-64

23

GND

1401

-64

24

MODSET

1205

-64

25

TX_FAULT

1016

-64

26

SHUTDOWN

818

-64

27

623

-64

28

GND

435

-64

29

GND

245

-64

22

MAX3735

MAX3735A

23

24

21

20

19

7

89

10

11

12

1

2

3

4

5

6

18

17

16

15

14

13

Thin QFN*

(4mm x 4mm)

TOP VIEW

IN+

IN-

PC_MON

BC_MON

OUT-

OUT+

OUT+

BIAS

*THE EXPOSED PAD MUST BE CONNECTED TO CIRCUIT BOARD GROUND FOR PROPER

THERMAL AND ELECTRICAL PERFORMANCE.

Pin Configuration