UCSP reliability performance shows that it is capable of

performing reliably through environmental stresses.

Users should also be aware that as with any intercon-

nect system there are electromigration-based current

limits that, in this case, apply to the maximum allowable

current in the bumps. Reliability is a function of this cur-

rent, the duty cycle, lifetime, and bump temperature.

See the Absolute Maximum Ratings section for any

specific limitations listed under Continuous Operating

Lifetime.Results of environmental stress tests and addi-

tional usage data and recommendations are detailed in

the UCSP application note, which can be found on

Maxim’s website at www.maxim-ic.com.

Chip Information

TRANSISTOR COUNT: 486

2.4GHz to 2.5GHz

Linear Power Amplifier

8

_______________________________________________________________________________________

GND

NOTE: REFER TO MAX2242 EV KIT DATA SHEET FOR DETAILED LAYOUT INFORMATION.

GND

GND

BIAS

CIRCUIT

DETECTOR

DET

OUT

6pF

1.8pF

100pF

10nH

33pF

0.1

µF

33pF

0.1

µF

RF_IN

BIAS

DAC

PD_OUT

47k

Ω

R2

8k

Ω

R1

8k

Ω

0.1

µF

2.2nH

SHDN

RF_OUT

50

Ω

Typical Application Circuit

BOTTOM VIEW

CHIP-SCALE PACKAGE (ALL DIMENSIONS IN mm)

SIDE VIEW

C4

C3

C2

C1

B4

B2

B3

NOT

USED

B1

A4

A3

A2

A1

0.75

MAX

1.5

0.5

Package Diagram