UPD72001C datasheet(37/40 Pages) NEC

37 / 40 page

µPD72001-11, 72001-A8

•

µPD72001GC-11-3B6 : 52-pin plastic QFP (14 × 14 mm)

µPD72001GC-A8-3B6: 52-pin plastic QFP (14 × 14 mm)

Soldering Method

Soldering Condition

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235

°C, Time: 30 seconds MAX.

IR35-00-3

(210

°C MIN.), Number of times: 3 MAX.

VPS

Package peak temperature: 215

°C, Time: 40 seconds MAX.

VP15-00-3

(200

°C MIN.), Number of times: 3 MAX.

Wave soldering

Solder bath temperature: 260

°C MAX., Time: 10 seconds MAX.,

WS60-00-1

Number of times: 1

Preheating temperature: 120

°C MAX. (package surface temperature)

Partial heating

Pin temperature: 300

°C MAX., Time: 3 seconds MAX.

—

(per side of device)

Caution Do not use two or more soldering methods in combination (except partial heating).

•

µPD72001L-11: 52-pin plastic QFJ (750 × 750 mil)

Soldering Method

Soldering Condition

Recommended

Condition Symbol

VPS

Package peak temperature: 215

°C, Time: 40 seconds MAX.

VP15-00-1

(200

°C MIN.), Number of times: 1

Partial heating

Pin temperature: 300

°C MAX., Time: 3 seconds MAX.

—

(per side of device)

Through-hole type

•

µPD72001C-11 : 40-pin plastic DIP (600 mil)

µPD72001C-A8: 40-pin plastic DIP (600 mil)

Soldering Method

Soldering Condition

Wave soldering (pins only)

Solder bath temperature: 260

°C MAX., Time: 10 seconds MAX.

Partial heating

Pin temperature: 300

°C MAX., Time: 3 seconds MAX.

(per pin)

Caution When soldering this product using of wave soldering, exercise care that the solder does not come

in direct contact with the package.

UPD72001C bảng dữ liệu(PDF) 37 Page - NEC

UPD72001C bảng dữ liệu(HTML) 37 Page - NEC

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