µPD61P24

30

22. RECOMMENDED SOLDERING CONDITIONS

It is recommended that

µPD6124A and 6600A be soldered under the following conditions.

For details on the recommended soldering conditions, refer to Information Document, Semiconductor Device

Mounting Technology Manual (C10535E).

For other soldering methods and conditions, consult NEC.

Table 22-1. Soldering Conditions of Surface-Mount Type

µPD61P24GS: 20-pin plastic SOP (300 mil)

Soldering Method

Soldering Conditions

Partial Heating

Pin temperature: 300

°C max., time: 3 seconds max. (per device side)

Table 22-2. Soldering Conditions of Through-Hole Type

µPD61P24CS: 20-pin plastic shrink DIP (300 mil)

Soldering Method

Soldering Conditions

Wave Soldering (Only for pin part)

Solder bath temperature: 260

°C max., time: 10 seconds max.

Partial Heating

Pin temperature: 300

°C max., time: 3 seconds max. (per pin)

Caution When soldering this product using of wave soldering, exercise care that the solder does not come

in direct contact with the package.