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AN3152 bảng dữ liệu(PDF) 14 Page - STMicroelectronics |
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AN3152 bảng dữ liệu(HTML) 14 Page - STMicroelectronics |
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14 / 17 page ![]() SiC technology vs. silicon AN3152 14/17 Doc ID 17056 Rev 1 4 SiC technology vs. silicon When using very fast power MOSFETs, the use of very fast diodes is also necessary in order to prevent failures. Unfortunately, due to the relatively slow recovery of silicon diodes, (even ultra-fast silicon diodes) they cannot be used in this project. In order to meet the new requirements, ST has developed and introduced a new family of diodes using the new silicon carbide technology. Silicon carbide diodes are virtually free of recovery current, even if, due to the charge and discharge of the parasitic capacitance, a peak current is still present during commutation. But this peak value is very low compared to a silicon diode using the same forward and breakdown voltage. These devices are the best choice for a high-end solar application where performance is the primary target. A comparison between SiC and silicon diodes has been performed in a side-by-side test between a silicon ultra-fast diode and a SiC with the same forward parameters, and using a di/dt = 800 A/µs. Table 2 provides the results of this comparison. Figure 11 shows the recovery at I F = 5 A. This clearly shows that the silicon diode has a Qrr that is ten times higher and more than 3 times the IRM of the SiC diodes. This higher peak current triggers an immediate failure of the power MOSFET if it is used on the converter prototype. In other words, silicon diodes cannot be used in this type of design where the di/dt is very high (from 800 A/µs to 2000 A/µs). Figure 11. Silicon vs. SiC diode comparison @ IF = 5 A, di/dt = 840 A/µs Table 2. Silicon vs. SiC diode comparison @ IF = 5 A, di/dt = 840 A/µs Parameter STPCS1006D STTH8L06D VF@5 A, TJ = 25 °C 1.12 1.2 VF@5 A, TJ = 150 °C 1.12 0.9 Qrr (nC) 26 293 IRM (A) 3.7 9.9 Trr (ns) 13 44 |
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