W9812G2KB datasheet(4/43 Pages) WINBOND

tên linh kiện	W9812G2KB

Giải thích chi tiết về linh kiện	1M X 4 BANKS X 32 BITS SDRAM

PDF	43 Pages

Scroll/Zoom	100%

nhà sản xuất	WINBOND [Winbond]

Trang chủ	http://www.winbond.com

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4 / 43 page

W9812G2KB

Publication Release Date: Jun. 20, 2014

- 4 -

Revision: A01

BLOCK DIAGRAM (DDP)

CLK

CKE

CAS, RAS, WE

BS0, BS1

A[11:0]

VDD

VDDQ

VSS

VSSQ

LDQM, UDQM

DQ[15:0]

64M (x16) bits

SDRAM 1

VDD

VDDQ

VSS

VSSQ

DQM0, DMQ1

DQ[15:0]

DQM2, DQM3

DQ[31:16]

CLK

CKE

BS0, BS1

A[11:0]

CLK

CKE

BS0, BS1

A[11:0]

VDD

VDDQ

VSS

VSSQ

LDQM, UDQM

DQ[15:0]

64M (x16) bits

SDRAM 2

CAS, RAS, WE

Note:

There two same 4M x16 SDRAM chips sealed in this product. The specification in the following

pages are for the one chip, the 64M

bits SDRAM’ except output slew rate, IDD and ball capacitance.

Although each die is tested individually within the dual-die package, some stacked die test results

may vary from a like-die tested within a monolithic die package.

ORDER INFORMATION

PART NUMBER

SPEED

SELF REFRESH

CURRENT (MAX.)

OPERATING

TEMPERATURE

W9812G2KB-6

166MHz/CL3

4mA

0°C ~ 70°C

W9812G2KB-6I

166MHz/CL3

4mA

-40°C ~ 85°C

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