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HT1621 bảng dữ liệu(PDF) 6 Page - Holtek Semiconductor Inc |
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HT1621 bảng dữ liệu(HTML) 6 Page - Holtek Semiconductor Inc |
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6 / 20 page ![]() Pad Description Pad No. Pad Name I/O Function 1CS I Chip selection input with pull-high resistor When the CS is logic high, the data and command read from or written to the HT1621 are disabled. The serial interface circuit is also reset. But if CS is at logic low level and is input to the CS pad, the data and command transmission between the host con- troller and the HT1621 are all enabled. 2RD I READ clock input with pull-high resistor Data in the RAM of the HT1621 are clocked out on the falling edge of the RD signal. The clocked out data will appear on the DATA line. The host controller can use the next rising edge to latch the clocked out data. 3WR I WRITE clock input with pull-high resistor Data on the DATA line are latched into the HT1621 on the ris- ing edge of the WR signal. 4 DATA I/O Serial data input/output with pull-high resistor 5 VSS ¾ Negative power supply, ground 7 OSCI I The OSCI and OSCO pads are connected to a 32.768kHz crystal in order to generate a system clock. If the system clock comes from an external clock source, the external clock source should be connected to the OSCI pad. But if an on-chip RC oscillator is selected instead, the OSCI and OSCO pads can be left open. 6 OSCO O 8 VLCD I LCD power input 9 VDD ¾ Positive power supply 10 IRQ O Time base or WDT overflow flag, NMOS open drain output 11, 12 BZ, BZ O 2kHz or 4kHz tone frequency output pair 13~16 COM0~COM3 O LCD common outputs 48~17 SEG0~SEG31 O LCD segment outputs Absolute Maximum Ratings Supply Voltage.................................-0.3V~5.5V Storage Temperature....................-50 oC~125oC Input Voltage....................VSS-0.3V~VDD+0.3V Operating Temperature..................-25 oC~75oC Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maxi- mum Ratings may cause substantial damage to the device. Functional operation of this de- vice at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. HT1621 6 April 21, 2000 |
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