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PDTC115TS bảng dữ liệu(PDF) 4 Page - NXP Semiconductors

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Giải thích chi tiết về linh kiện  NPN resistor-equipped transistors; R1 =100 kW, R2 open
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PDTC115TS bảng dữ liệu(HTML) 4 Page - NXP Semiconductors

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© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2005
4 of 10
Philips Semiconductors
PDTC115T series
NPN resistor-equipped transistors; R1 = 100 k
Ω, R2 = open
5.
Limiting values
[1]
Refer to standard mounting conditions.
[2]
Reflow soldering is the only recommended soldering method.
[3]
Refer to SOT883 standard mounting conditions; FR4 printed-circuit board with 60
µm copper strip line.
6.
Thermal characteristics
[1]
Refer to standard mounting conditions.
[2]
Reflow soldering is the only recommended soldering method.
[3]
Refer to SOT883 standard mounting conditions; FR4 printed-circuit board with 60
µm copper strip line.
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCBO
collector-base voltage
open emitter
-
50
V
VCEO
collector-emitter voltage
open base
-
50
V
VEBO
emitter-base voltage
open collector
-
5
V
IO
output current (DC)
-
100
mA
ICM
peak collector current
-
100
mA
Ptot
total power dissipation
SOT416
Tamb ≤ 25 °C
[1] -
150
mW
SOT346
Tamb ≤ 25 °C
[1] -
250
mW
SOT883
Tamb ≤ 25 °C
[2] [3] -
250
mW
SOT54
Tamb ≤ 25 °C
[1] -
500
mW
SOT23
Tamb ≤ 25 °C
[1] -
250
mW
SOT323
Tamb ≤ 25 °C
[1] -
200
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Table 7:
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
SOT416
[1] -
-
833
K/W
SOT346
[1] -
-
500
K/W
SOT883
[2] [3] -
-
500
K/W
SOT54
[1] -
-
250
K/W
SOT23
[1] -
-
500
K/W
SOT323
[1] -
-
625
K/W



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