PKB4113CPI datasheet(42/43 Pages) ERICSSON

42 / 43 page

Ericsson Internal

PROD. SPECIFICATION MECHANICAL

2 (4)

Prepared (also subject responsible if other)

No.

MICJAN

5/1301-BMR 655 Uen

Approved

Checked

Date

Rev

Reference

MPM/BK/P [Natalie Johansson]

See §1

2007-05-29

Soldering Information – Through Hole Mounting

The through hole mount version of the product is intended for

manual or wave soldering. When wave soldering is used, the

temperature on the pins is specified to maximum 270°C for

maximum 10 seconds.

A maximum preheat rate of 4°C/s and a temperature of max

+150°C is suggested. When soldering by hand, care should

be taken to avoid direct contact between the hot soldering iron

tip and the pins for more than a few seconds in order to

prevent overheating.

A no-clean flux is recommended to avoid entrapment of

cleaning fluids in cavities inside the product or between the

product and the host board. The cleaning residues may affect

long time reliability and isolation voltage.

Delivery Package Information, Surface Mount

Version

The surface mount versions of the products are delivered in

antistatic injection molded trays (Jedec design guide 4.10D

standard.

Tray Specifications

Material

PPE, Antistatic

Surface resistance

5 < Ohm/square < 1012

Bakability

The trays can be baked at maximum

125°C for 48 hours

Tray capacity

20 products/tray

Tray thickness

14.4 mm [0.567 inch]

Box capacity

100 products (5 full trays/box)

Tray weight

110 g empty, 530 g full tray

Dry Pack Information

The surface mount versions of the products are delivered in

trays These inner shipment containers are dry packed in

standard moisture barrier bags according to IPC/JEDEC

standard J-STD-033 (Handling, packing, shipping and use of

moisture/reflow sensitivity surface mount devices).

Using products in high temperature Pb-free soldering

processes requires dry pack storage and handling. In case the

products have been stored in an uncontrolled environment

and no longer can be considered dry, the modules must be

baked according to J-STD-033.

Delivery Package Information, Through Hole

versions

The products are delivered in antistatic trays.

Tray Specifications

Material

PE foam, antistatic.

Surface resistance

5 < Ohm/square < 1012

Bakability

The trays are not bakable

Tray capacity

25 products/tray

Tray thickness Open

Frame version

18 mm [0.71 inch]

Tray thickness Base

Plate version

22 mm [0.87 inch]

Box capacity Open

Frame version

100 products (4 full trays/box)

Box capacity Base Plate

version

50 products (2 full trays/box)

Tray weight Open Frame

version

30 g empty, 550 g full tray

Tray weight Base Plate

version

40 g empty, 1040 g full tray

PKB4000C series Direct Converters

Input 36-75 V, Output up to 60 A / 144 W

EN/LZT 146 377 R4

D September 2013

Technical Speciﬁcation

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