PKB4113CPI datasheet(41/43 Pages) ERICSSON

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Ericsson Internal

PROD. SPECIFICATION MECHANICAL

1 (4)

Prepared (also subject responsible if other)

No.

MICJAN

5/1301-BMR 655 Uen

Approved

Checked

Date

Rev

Reference

MPM/BK/P [Natalie Johansson]

See §1

2007-05-29

Soldering Information - Surface Mounting

The surface mount version of the product is intended for

convection or vapor phase reflow SnPb and Pb-free

processes. To achieve a good and reliable soldering result,

make sure to follow the recommendations from the solder

paste supplier, to use state-of-the-art reflow equipment and

reflow profiling techniques as well as the following guidelines.

A no-clean flux is recommended to avoid entrapment of

cleaning fluids in cavities inside the product or between the

product and the host board. The cleaning residues may affect

long time reliability and isolation voltage.

Minimum Pin Temperature Recommendations

Pin number 4 is chosen as reference location for the minimum

pin temperature recommendations since this will likely be the

coolest solder joint during the reflow process.

Pin 4 for measurement of minimum

solder joint temperature, TPIN

Pin 2 for measurement of maximum

peak product reflow temperature, T

SnPb solder processes

For SnPb solder processes, a pin temperature (TPIN) in excess

of the solder melting temperature, (TL, +183°C for Sn63/Pb37)

for more than 30 seconds, and a peak temperature of +210°C

is recommended to ensure a reliable solder joint.

Lead-free (Pb-free) solder processes

For Pb-free solder processes, a pin temperature (TPIN) in

excess of the solder melting temperature (TL, +217 to +221°C

for Sn/Ag/Cu solder alloys) for more than 30 seconds, and a

peak temperature of +235°C on all solder joints is

recommended to ensure a reliable solder joint.

Peak Product Temperature Requirements

Pin number 2 is chosen as reference location for the

maximum (peak) allowed product temperature (TP) since this

will likely be the warmest part of the product during the reflow

process.

To avoid damage or performance degradation of the product,

the reflow profile should be optimized to avoid excessive

heating. A sufficiently extended preheat time is recommended

to ensure an even temperature across the host PCB, for both

small and large devices. To reduce the risk of excessive

heating is also recommended to reduce the time in the reflow

zone as much as possible.

SnPb solder processes

For SnPb solder processes, the product is qualified for MSL 1

according to IPC/JEDEC standard J-STD-020C.

During reflow, TP must not exceed +225°C at any time.

Lead-free (Pb-free) solder processes

For Pb-free solder processes, the product is qualified for

MSL 3 according to IPC/JEDEC standard J-STD-020C.

During reflow, TP must not exceed +260°C at any time.

25 °C

Time

Temperature

Ramp-down

(cooling)

Ramp-up

Reflow

Preheat

Time 25 °C to peak

Reflow process specifications

Sn/Pb eutectic

Pb-free

Average ramp-up rate

3°C/s max

Solder melting

temperature (typical)

+183°C

+221°C

Minimum time above TL

30 s

Minimum pin temperature

TPIN

+210°C

+235°C

Peak product temperature

+225°C

+260°C

Average ramp-down rate

6°C/s max

Time 25°C to peak

6 minutes max

8 minutes max

PKB4000C series Direct Converters

Input 36-75 V, Output up to 60 A / 144 W

EN/LZT 146 377 R4

D September 2013

Technical Speciﬁcation

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