1–12

Chapter 1: Cyclone III Device Family Overview

Reference and Ordering Information

Cyclone III Device Handbook

July 2012

Altera Corporation

Volume 1

Reference and Ordering Information

Figure 1–1 and Figure 1–2 show the ordering codes for Cyclone III and Cyclone III LS

devices.

Figure 1–1. Cyclone III Device Packaging Ordering Information

Family Signature

Package Type

Package Code

Operating Temperature

Speed Grade

Optional Suffix

Indicates specific device

options or shipment method

EP3C : Cyclone III

5

: 5,136 logic elements

10 : 10,320 logic elements

16 : 15,408 logic elements

25 : 24,624 logic elements

25E : 24,624 logic elements

40 : 39,600 logic elements

55 : 55,856 logic elements

80 : 81,264 logic elements

120 : 119,088 logic elements

E

: Plastic Enhanced Quad Flat Pack (EQFP)

Q

: Plastic Quad Flat Pack (PQFP)

F

: FineLine Ball-Grid Array (FBGA)

U

: Ultra FineLine Ball-Grid Array (UBGA)

M

: Micro FineLine Ball-Grid Array (MBGA)

144 : 144 pins

164 : 164 pins

240 : 240 pins

256 : 256 pins

324 : 324 pins

484 : 484 pins

780 : 780 pins

C

I

A

6 (fastest)

7

8

N

: Lead-free packaging

ES : Engineering sample

EP3C

25

F

324

C

7

N

Member Code

Figure 1–2. Cyclone III LS Device Packaging Ordering Information

Family Signature

Package Type

Package Code

Operating Temperature

Speed Grade

Optional Suffix

Indicates specific device

options or shipment method

EP3CLS : Cyclone III LS

70 : 70,208 logic elements

100 : 100,448 logic elements

150 : 150,848 logic elements

200 : 198,464 logic elements

F

: FineLine Ball-Grid Array (FBGA)

U

: Ultra FineLine Ball-Grid Array (UBGA)

484 : 484 pins

780 : 780 pins

C

I

7 (fastest)

8

N

: Lead-free packaging

ES : Engineering sample

EP3CLS

70

F

484

C

7

N

Member Code