For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

i_wound_CB_LB_prec_e-E02R01

WIRE-WOUND CHIP INDUCTORS (LB SERIES)，

WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES)，

WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)

1．Circuit Design

Precautions

◆Operating environment

1. The products described in this specification are intended for use in general electronic equipment, (office supply equipment,

telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical

equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear

control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or

damage. For such uses, contact TAIYO YUDEN Sales Department in advance.

2．PCB Design

Precautions

◆Land pattern design

1. Please contact any of our offices for a land pattern, and refer to a recommended land pattern of a right figure or specifications.

Technical

considerations

PRECAUTIONS

【Recommended Land Patterns】

Surface Mounting

・ Mounting and soldering conditions should be checked beforehand.

・ Applicable soldering process to those products is reflow soldering only.

3．Considerations for automatic placement

Precautions

◆Adjustment of mounting machine

1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.

2. Mounting and soldering conditions should be checked beforehand.

Technical

considerations

1. When installing products, care should be taken not to apply distortion stress as it may deform the products.

4．Soldering

Precautions

◆Reflow soldering（ LB and CB Types）

1. For reflow soldering with either leaded or lead-free solder, the profile specified in "point for controlling" is recommended.

◆Recommended conditions for using a soldering iron

1. Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350℃ Duration-3 seconds or less. The soldering iron

should not come in contact with inductor directly.

Technical

considerations

◆Reflow soldering（ LB and CB Types）

1. Reflow profile

◆Recommended conditions for using a soldering iron

1. Components can be damaged by excessive heat where soldering conditions exceed the specified range.

5．Cleaning

Precautions

◆Cleaning conditions

Washing by supersonic waves shall be avoided.

Technical

considerations

◆Cleaning conditions

If washed by supersonic waves, the products might be broken.