| công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
|
LBR2012T2R2M bảng dữ liệu(PDF) 14 Page - Taiyo Yuden (U.S.A.), Inc |
|
|
|||||||||||||||||||||||||||||
LBR2012T2R2M bảng dữ liệu(HTML) 14 Page - Taiyo Yuden (U.S.A.), Inc |
|
14 / 14 page ![]() ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_CB_LB_prec_e-E02R01 6.Handling Precautions ◆Handling 1. Keep the inductors away from all magnets and magnetic objects. ◆Breakaway PC boards( splitting along perforations) 1. When splitting the PC board after mounting inductors, care should be taken not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. ◆Mechanical considerations 1. Please do not give the inductors any excessive mechanical shocks. Technical considerations ◆Handling 1. There is a case that a characteristic varies with magnetic influence. ◆Breakaway PC boards( splitting along perforations) 1. Planning pattern configurations and the position of products should be carefully performed to minimize stress. ◆Mechanical considerations 1. There is a case to be damaged by a mechanical shock. 7.Storage conditions Precautions ◆Storage 1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled. ・ Recommended conditions Ambient temperature:0~40℃ / Humidity:Below 70% RH The ambient temperature must be kept below 30℃ even under ideal storage conditions, solderability of products electrodes may decrease as time passes. For this reason, LB type:Should be used within 6 months from the time of delivery. Technical considerations ◆Storage 1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. |
|
|
Link URL |
| Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không? [ DONATE ] |
Alldatasheet là | Quảng cáo | Liên lạc với chúng tôi | Chính sách bảo mật | Liên kết đến bảng dữ liệu | Trao đổi link | Tìm kiếm theo nhà sản xuất All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |