CYStech Electronics Corp.

Spec. No. : C660P3

Issued Date : 2008.07.22

Revised Date :2011.01.04

Page No. : 5/5

BU941ZP3

CYStek Product Specification

TO-247 Dimension

*: Typical

Inches

Marking:

BU941Z

Style: Pin 1.Base 2.Collector 3.Emitter

4.Collector

3-Lead TO-247 Plastic Package

CYStek Package Code: P3

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.191

0.200

4.850

5.150

E2

0.142 REF

3.600 REF

A1

0.087

0.102

2.200

2.600

L

1.610

1.626

40.900

41.300

b

0.039

0.055

1.000

1.400

L1

0.976

0.988

24.800

25.100

b1

0.110

0.126

2.800

3.200

L2

0.799

0.811

20.300

20.600

b2

0.071

0.087

1.800

2.200

Φ

0.280

0.287

7.100

7.300

c

0.020

0.028

0.500

0.700

e

0.215 REF

5.450 REF

c1

0.075

0.083

1.900

2.100

H

0.235 REF

5.980 REF

D

0.608

0.620

15.450

15.750

h

0.000

0.012

0.000

0.300

E1

0.138 REF

3.500 REF

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.