PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

2

Absolute Maximum Ratings

Maximum Operating Junction Temperature ..........................................................................................................................150°C

Storage Temperature Range .....................................................................................................................................-65°C to +150°C

Lead Temperature Soldering

Reflow (SMD styles only) ...........................................................................................60 sec. max above 183°C, 230°C peak

ESD Damage Threshold (Human Body Model)....................................................................................................................2kV

PIN SYMBOL

PIN NAME

IC Power Input

14V

-0.3V

100mA

Internally

Limited

Output Voltage

6V

-0.3V

Internally

100mA

Limited

AuxDrv

Auxiliary Drive Output

14V

-0.3V

10mA

50mA

Gnd

IC Ground

N/A

N/A

N/A

N/A

s

Linear Regulator

Output Voltage

3.234

3.300

3.366

V

-2%

+2%

Line Regulation

1

5

mV

Load Regulation

5

15

mV

Ground Current

2

3

mA

3

6

mA

Reverse Current

0.45

1

mA

Current Limit

0.55

0.85

1.2

A

Thermal Shutdown

Note 1

150

180

210

°C

Thermal Shutdown Hysteresis

Note 1

25

°C

s

Auxiliary Drive

4.35

4.5

4.65

V

and AuxDrv drives high

4.25

4.4

4.55

V

and AuxDrv drives low

75

100

125

mV

Output Low Voltage

0.1

0.4

V

Output Low Peak Voltage

0.65

0.9

V

Record peak AuxDrv output voltage

AuxDrv Current Limit

0.5

6

25

mA

Response Time

1

10

µs

Pull-Up/Down Resistance

5

10

25

kΩ

Note 1: Guaranteed by design, not 100% production tested. Thermal shutdown is 100% functionally tested at wafer

probe.