LM7372IMA datasheet(3/26 Pages) NSC

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LM7372

www.ti.com

SNOS926E – MAY 1999 – REVISED MARCH 2013

Absolute Maximum Ratings

(1) (2) (3)

ESD Tolerance

Human Body Model

1.5kV(4)

Machine Model

200V(4)

Suppy Voltage (V+

−V−)

36V

Differential Input Voltage (VS = ±15V)

±10V

Output Short Circuit to Ground(2)

Continuous

Storage Temp. Range

−65°C to 150°C

Soldering Information

Infrared or Convection Reflow (20 sec.)

235°C

Wave Soldering Lead Temperature (10 sec.)

260°C

Input Voltage

V− to V+

Maximum Junction Temperature(5)

150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

For testing purposes, ESD was applied using human body model, 1.5k

Ω in series with 100pF. Machine model, 0Ω in series with 200pF.

(5)

The maximum power dissipation is a function of T(JMAX), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (T(JMAX) – TA)/θJA. All numbers apply for packages soldered directly into a PC board. The value for θJA is 106°C/W

for the 16-Pin SOIC package. With a total area of 4sq. in of 1oz CU connected to pins 1,6,8,9 & 16,

θJA for the 16-Pin SOIC is

decreased to 70°C/W. 8-Pin SO PowerPAD package

θJA is with 2 in

2 heatsink (top and bottom layer each) and 1 oz. copper (see

Table 2).

Operating Ratings

(1)

Supply Voltage

≤ VS ≤ 36V

Junction Temperature Range (TJ)

LM7372

−40°C ≤ TJ ≤ 85°C

Thermal Resistance(

θJA)

16-Pin SOIC(2)

106°C/W

70°C/W

8-Pin SO PowerPAD(2)

(see Application Information)

47°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

The maximum power dissipation is a function of T(JMAX), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (T(JMAX) – TA)/θJA. All numbers apply for packages soldered directly into a PC board. The value for θJA is 106°C/W

for the 16-Pin SOIC package. With a total area of 4sq. in of 1oz CU connected to pins 1,6,8,9 & 16,

θJA for the 16-Pin SOIC is

decreased to 70°C/W. 8-Pin SO PowerPAD package

θJA is with 2 in

2 heatsink (top and bottom layer each) and 1 oz. copper (see

Table 2).

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