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ST1S40 bảng dữ liệu(PDF) 18 Page - STMicroelectronics |
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ST1S40 bảng dữ liệu(HTML) 18 Page - STMicroelectronics |
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18 / 29 page ![]() Application information ST1S40 18/29 DocID17928 Rev 5 Figure 7. Switching losses 6.5 Layout consideration The PC board layout of switching DC-DC regulator is very important in order to minimize the noise injected in high impedance nodes, to reduce interferences generated by the high switching current loops, and to optimize the reliability of the device. In order to avoid EMC problems, the high switching current loops must be as short as possible. In the buck converter there are two high switching current loops: during the ON time, the pulsed current flows through the input capacitor, the high side power switch, the inductor and the output capacitor; during the OFF time, through the low side power switch, the inductor and the output capacitor. The input capacitor connected to VINSW must be placed as close as possible to the device, to avoid spikes on VINSW due to the stray inductance and the pulsed input current. In order to prevent dynamic unbalance between VINSW and VINA, the trace connecting the VINA pin to the input must be derived from VINSW. The feedback pin (FB) connection to the external resistor divider is a high impedance node, so the interferences can be minimized through the routing of the feedback node with a very short trace and as far as possible from the high current paths. A single point connection from signal ground to power ground is suggested. Thanks to the exposed pad of the device, the ground plane helps to reduce the thermal resistance junction to ambient; so a large ground plane, soldered to the exposed pad, enhances the thermal performance of the converter allowing high power conversion. VSW ISW,HS VIN VDS,HS PCOND,HS PCOND,LS PSW TFALL TRISE |
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