0

5

10

15

20

25

30

35

0

10

20

30

40

50

60

70

80

90

Ambient Temperature (ºC)

400LFM

200LFM

100LFM

Nat Conv

G001

0

5

10

15

20

25

30

35

0

20

40

60

80

100

120

140

Board Temperature (ºC)

G001

0

1

2

3

4

5

6

7

8

1

4

7

10

13

16

19

22

25

28 30

Output Current (A)

G001

0.5

0.6

0.7

0.8

0.9

1

1.1

−50

−25

0

25

50

75

100

125

150

Junction Temperature (ºC)

G001

CSD87384M

www.ti.com

SLPS415B – SEPTEMBER 2013 – REVISED JANUARY 2014

Typical Power Block Device Characteristics

Figure 1. Power Loss vs Output Current

Figure 2. Normalized Power Loss vs Temperature

(1)

The Typical Power Block System Characteristic curves are based on measurements made on a PCB design with

dimensions of 4.0 inches (W) × 3.5 inches (L) x 0.062 inch (H) and 6 copper layers of 1-oz. copper thickness. See

Application Section for detailed explanation.

Copyright © 2013–2014, Texas Instruments Incorporated

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