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AS3665 bảng dữ liệu(PDF) 5 Page - ams AG

tên linh kiện AS3665
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AS3665 bảng dữ liệu(HTML) 5 Page - ams AG

  AS3665 Datasheet HTML 1Page - ams AG AS3665 Datasheet HTML 2Page - ams AG AS3665 Datasheet HTML 3Page - ams AG AS3665 Datasheet HTML 4Page - ams AG AS3665 Datasheet HTML 5Page - ams AG AS3665 Datasheet HTML 6Page - ams AG AS3665 Datasheet HTML 7Page - ams AG AS3665 Datasheet HTML 8Page - ams AG AS3665 Datasheet HTML 9Page - ams AG Next Button
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www.austriamicrosystems.com
Revision 1.0.2
4 - 77
AS3665
Datasheet, Confidential - A b s o l u t e M a x i m u m R a t i n g s P i n D e s c r i p t i o n
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Table 3, “Electrical
Characteristics,” on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
VBAT, VCP, C1+, C1-,
C2+, C2- to GND
-0.3
+7.0
V
VCP to VBAT
-0.3
V
Note: Diode between VCP and VBAT
LED1, LED2...LED9 to GND
-0.3
VCP +
0.3
V
7.0
SDA, SCL, EN, CLK32K, TRIG,
INT/AUDIO_IN, GPO, ADDR, C2V5 to GND
-0.3
VBAT +
0.3
V
7.0
Input Pin Current without causing latchup
-100
+100
+IIN
mA
Norm: EIA/JESD78
Continuous Power Dissipation (TA = +70ºC)
Continuous power dissipation
0.78
mW
PT
1
1. Depending on actual PCB layout and PCB used
Continuous power dissipation derating factor
14.2
mW/ºC
PDERATE
2
2. PDERATE derating factor changes the total continuous power dissipation (PT) if the ambient temperature is not
70ºC. Therefore for e.g. TAMB=85ºC calculate PT at 85ºC = PT - PDERATE * (85ºC - 70ºC)
Electrostatic Discharge
ESD HBM
±1000
V
Norm: JEDEC JESD22-A114F
ESD CDM
±500
V
Norm: JEDEC JESD 22-C101C
ESD MM
±200
V
Norm: JEDEC JESD 22-A115-A level A
Temperature Ranges and Storage Conditions
Junction Temperature
+150
ºC
Internally limited (overtemperature
protection)
Storage Temperature Range
-55
+125
ºC
Humidity
5
85
%
Non condensing
Body Temperature during Soldering
+260
ºC
according to IPC/JEDEC J-STD-020C



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