PD720201 datasheet(40/43 Pages) RENESAS

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μPD720201/μPD720202

5. RECOMMENDED SOLDERING CONDITIONS

R19DS0047EJ0500 Rev. 5.00

Page 40 of 40

Jan. 17, 2013

5. RECOMMENDED SOLDERING CONDITIONS

The

μPD720201 and μPD720202 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact a Renesas Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.renesas.com/prod/package/manual/ )

•

μPD720201K8-701-BAC-A : 68-PIN QFN (8x8)

•

μPD720202K8-701-BAA-A : 48-PIN QFN (7x7)

•

μPD720201K8-711-BAC-A : 68-PIN QFN (8x8)

•

μPD720202K8-711-BAA-A : 48-PIN QFN (7x7)

Soldering Method

Soldering Conditions

Symbol

Infrared reflow

Peak package’s surface temperature: 260°C, Reflow time: 60 seconds or less

(220°C or higher), Maximum allowable number of reflow processes: 3,

Exposure limit

Note

: 7 days (10 hours pre-backing is required at 125°C afterwards),

Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.

Non-heat-resistant trays, such as magazine and taping trays, cannot be baked

before unpacking.

IR60-107-3

Note

The Maximum number of days during which the product can be stored at a temperature of 25°C and a relative

humidity of 65% or less after dry-pack package is opened.

PD720201 bảng dữ liệu(PDF) 40 Page - Renesas Technology Corp