PixArt Imaging Inc.

PAC7352

USB 2.0 VGA Camera SoC

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PixArt Imaging Inc.

E-mail:

fae_service@PixArt.com.tw

V1.0 Feb. 2012

3.8

Handling precaution for the prevention of ESD

Explained below are procedures that must be taken in fabrication to prevent the

electrostatic destruction of semiconductor devices.

The following basic rules must be obeyed.

1. Equalize potentials of terminals when transporting or storing.

2. Equalize the potentials of the electric device, work table, and operator's body that

may come in contact with the IC's.

3. Prepare an environment that does not generate static electricity.

One method is keeping relative humidity in the work room to about 50%.

Operator

1. The operator should wear wrist straps.

(Must maintain electric contact with bare skin)

2. Wear cotton or antistatic-treated materials clothes and gloves.

3. When a conductive mat will be used, must be ware conductive shoes.

4. Do not touch the IC's leads. Touch the body of IC's when holding.

Equipment and tools

1. Any electrical equipments and tools located on the work table surface must be

isolated from The work table surface, and ground the equipments and tools that are

to be used.

2. Work table surface must be use conductive material or conductive mat.

(Should be ground through a 1MΩ resistor)

Transporting, storing and packing

1. Use conductive IC's tray, and conductive or shielding bag to store IC's.

Soldering operation

1. Use a soldering iron with a grounding wire.

2. When perform manual soldering operation, the operator should wear wrist straps.

3. Do not use the desoldering pump when removing the IC's from the PCB board. Use

a solder-wick or equivalent.