PixArt Imaging Inc.

PAC7352

USB 2.0 VGA Camera SoC

All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission

.

9

PixArt Imaging Inc.

E-mail:

fae_service@PixArt.com.tw

V1.0 Feb. 2012

3.7

Recommended Guideline for PCB Assembly

Recommended vender and type for Pb-free solder paste

1.

Almit LFM-48W TM-HP

2.

Senju M705-GRN360-K

IR Reflow Soldering Profile:

Temperature profile is the most important control in reflow soldering. It must be fine tuned to

establish a robust process. The typical recommended IR reflow profile is showed in figure 8

below.

IR Reflow Profile

Reflow Profile :

1. Average Ramp-up Rate (30°C to preheat zone): 1.5~ 2.5 Degree C/ Sec

2. Preheat zone:

2.1

Temp ramp from 170~ 200 degree C

2.2

Exposure time: 90 +/- 30 sec

3. Melting zone:

3.1

Melting area temp > 220 degree C for at least 30 ~ 50 sec

3.2

Peak temperature : 245 degree C.