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STM32L151VD bảng dữ liệu(PDF) 134 Page - STMicroelectronics

tên linh kiện STM32L151VD
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STM32L151VD bảng dữ liệu(HTML) 134 Page - STMicroelectronics

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Package characteristics
STM32L151xD STM32L152xD
134/140
Doc ID 022027 Rev 6
7.2
Thermal characteristics
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max × ΘJA)
Where:
●
TA max is the maximum ambient temperature in °C,
●
ΘJA is the package junction-to-ambient thermal resistance, in °C/W,
●
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
●
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
Table 78.
Thermal characteristics
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
LQFP144 - 20 x 20 mm / 0.5 mm pitch
40
°C/W
Thermal resistance junction-ambient
UFBGA132 - 7 x 7 mm
60
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
43
Thermal resistance junction-ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
46
Thermal resistance junction-ambient
WLCSP64 - 0.400 mm pitch
46



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