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AM79C971VCW bảng dữ liệu(PDF) 233 Page - Advanced Micro Devices |
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AM79C971VCW bảng dữ liệu(HTML) 233 Page - Advanced Micro Devices |
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233 / 265 page ![]() APPENDIX B Am79C971 B-1 Recommendation for Power and Ground Decoupling The mixed analog/digital circuitry in the Am79C971 de- vice makes it imperative to provide noise-free power and ground connections to the device. Without clean power and ground connections, a design may suffer from high bit error rates or may not function at all. Hence, it is highly recommended that the guidelines presented here are followed to ensure a reliable de- sign. Decoupling/Bypass Capacitors Adequate decoupling of the power and ground pins and planes is required by all Am79C971 designs. This in- cludes both low-frequency bulk capacitors and high fre- quency capacitors. It is recommended that at least one low-frequency bulk (e.g., 22 µF) decoupling ca- pacitor be used in the area of the Am79C971 device. The bulk capacitor(s) should be connected directly to the power and ground planes. In addition, at least eight high frequency decoupling capacitors (e.g., 0.1 µF multilayer ceramic capacitors of dielectric type XDR) should be used around the periphery of the PCnet-PCI II device to prevent power and ground bounce from affecting device operation. To reduce the inductance between the power and ground pins and the capacitor, the pins should be connected directly to the capacitors, rather than through the planes to the ca- pacitors. The suggested connection scheme for the ca- pacitors is shown in the figure below. Note also that the traces connecting these pins to the capacitors should be as wide as possible to reduce inductance (15 mils is desirable). Figure 1. Connection Scheme for Capacitors Am79C971 Am79C971 Am79C971 C A P C A P C A P Best OK Not Recommended 19364D-1 |
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