ADG1209 datasheet(7/20 Pages) AD

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ADG1208/ADG1209

Rev. B | Page 7 of 20

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter

Rating

VDD to VSS

35 V

VDD to GND

−0.3 V to +25 V

VSS to GND

+0.3 V to −25 V

Analog, Digital Inputs1

VSS − 0.3 V to VDD + 0.3 V or

30 mA (whichever occurs first)

Continuous Current, S or D

30 mA

Peak Current, S or D (Pulsed at

1 ms, 10% Duty Cycle Maximum)

100 mA

Operating Temperature Range

Industrial (Y Version)

–40°C to +125°C

Storage Temperature

–65°C to +150°C

Junction Temperature

150°C

θJA, Thermal Impedance, TSSOP

112°C/W

θJA, Thermal Impedance, LFCSP_VQ

30.4°C/W

θJA, Thermal Impedance, SOIC_N

77°C/W

Reflow Soldering Peak

Temperature (Pb-Free)

260(+0/−5)°C

1 Overvoltages at A, EN, S, or D are clamped by internal diodes. Current should

be limited to the maximum ratings given.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

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