AM186 datasheet(61/112 Pages) AMD

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Am186TMER and Am188TMER Microcontrollers Data Sheet

DRAF

THERMAL CHARACTERISTICS

TQFP Package

The Am186ER and Am188ER microcontrollers are

specified for operation with case temperature ranges

from 0

°C to +100°C for a commercial temperature

device. Case temperature is measured at the top

center of the package as shown in Figure 16. The

various temperatures and thermal resistances can be

determined using the equations in Figure 17 with

information given in Table 10.

JA is the sum of θJC and θCA . θJC is the internal

thermal resistance of the assembly.

CA is the case to

ambient thermal resistance.

The variable P is power in watts. Typical power

supply current (ICC) for the Am186ER and Am188ER

microcontrollers is 3.7 mA per MHz of clock frequency.

Figure 16.

Thermal Resistance (

°C/Watt)

Figure 17. Thermal Characteristics Equations

Table 10.

Thermal Characteristics (

°C/Watt)

JA = θJC + θCA

Package/Board

Airflow

(Linear Feet

per Minute)

PQFP/2-Layer

0 fpm

200 fpm

400 fpm

600 fpm

TQFP/2-Layer

0 fpm

200 fpm

400 fpm

600 fpm

PQFP/4-Layer

to 6-Layer

0 fpm

200 fpm

400 fpm

600 fpm

TQFP/4-Layer

to 6-Layer

0 fpm

200 fpm

400 fpm

600 fpm

JA = θJC + θCA

P = ICC ⋅ freq (MHz) ⋅ VCC

TJ = TC + (P ⋅ θJC)

TJ = TA + (P ⋅ θJA)

TC = TJ – (P ⋅ θJC)

TC = TA + (P ⋅ θCA)

TA = TJ – (P ⋅ θJA)

TA = TC – (P ⋅ θCA)

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