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AGLP030 bảng dữ liệu(PDF) 20 Page - Microsemi Corporation

tên linh kiện AGLP030
Giải thích chi tiết về linh kiện  IGLOO PLUS Low Power Flash FPGAs
PDF  134 Pages
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nhà sản xuất  MICROSEMI [Microsemi Corporation]
Trang chủ  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

AGLP030 bảng dữ liệu(HTML) 20 Page - Microsemi Corporation

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IGLOO PLUS DC and Switching Characteristics
2-6
Revision 16
Thermal Characteristics
Introduction
The temperature variable in the Microsemi Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction temperature to be higher than the ambient temperature.
EQ 1 can be used to calculate junction temperature.
TJ = Junction Temperature = T + TA
EQ 1
where:
TA = Ambient temperature
T = Temperature gradient between junction (silicon) and ambient T = ja * P
ja = Junction-to-ambient of the package. ja numbers are located in Figure 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is
jc and the junction-to-ambient air thermal resistivity is
ja. The thermal characteristics for ja are shown for two air flow rates. The maximum operating junction
temperature is 100°C. EQ 2 shows a sample calculation of the maximum operating power dissipation
allowed for a 484-pin FBGA package at commercial temperature and in still air.
EQ 2
Temperature and Voltage Derating Factors
Maximum Power Allowed
Max. junction temp. (
C) Max. ambient temp. (C)
ja(C/W)
------------------------------------------------------------------------------------------------------------------------------------------
100
C70C
20.5°C/W
-------------------------------------
1.46 W
=
=
=
Table 2-5 • Package Thermal Resistivities
Package Type
Pin
Count
jc
ja
Units
Still Air
200 ft./
min.
500 ft./
min.
Chip Scale Package (CSP)
CS201
TBD
TBD
TBD
TBD
C/W
CS281
TBD
TBD
TBD
TBD
C/W
CS289
TBD
TBD
TBD
TBD
C/W
Very Thin Quad Flat Package (VQFP)
VQ128
TBD
TBD
TBD
TBD
C/W
VQ176
TBD
TBD
TBD
TBD
C/W
Table 2-6 • Temperature and Voltage Derating Factors for Timing Delays (normalized to TJ = 70°C,
VCC = 1.425 V)
For IGLOO PLUS V2 or V5 devices, 1.5 V DC Core Supply Voltage
Array Voltage
VCC (V)
Junction Temperature (°C)
–40°C
0°C
25°C
70°C
85°C
100°C
1.425
0.934
0.953
0.971
1.000
1.007
1.013
1.5
0.855
0.874
0.891
0.917
0.924
0.929
1.575
0.799
0.816
0.832
0.857
0.864
0.868



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