LM3410XMFE datasheet(15/49 Pages) TI

15 / 49 page

LM3410, LM3410Q

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SNVS541G – OCTOBER 2007 – REVISED MAY 2013

External Components: Choose components that are efficient, and you can reduce the mutual heating between

devices.

PCB design with thermal performance in mind:

The PCB design is a very important step in the thermal design procedure. The LM3410 is available in three

package options (5-pin SOT-23, 8-pin MSOP-PowerPad and 6-pin WSON). The options are electrically the

same, but difference between the packages is size and thermal performance. The WSON and MSOP-PowerPad

have thermal Die Attach Pads (DAP) attached to the bottom of the packages, and are therefore capable of

dissipating more heat than the SOT-23 package. It is important that the customer choose the correct package for

the application. A detailed thermal design procedure has been included in this data sheet. This procedure will

help determine which package is correct, and common applications will be analyzed.

There is one significant thermal PCB layout design consideration that contradicts a proper electrical PCB layout

design consideration. This contradiction is the placement of external components that dissipate heat. The

greatest external heat contributor is the external Schottky diode. It would be nice if you were able to separate by

distance the LM3410 from the Schottky diode, and thereby reducing the mutual heating effect. This will however

create electrical performance issues. It is important to keep the LM3410, the output capacitor, and Schottky

diode physically close to each other (see PCB layout guidelines). The electrical design considerations outweigh

the thermal considerations. Other factors that influence thermal performance are thermal vias, copper weight,

and number of board layers.

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