PACDN1404

http://onsemi.com

4

PACKAGE DIMENSIONS

WLCSP6, 1.80x1.15

CASE 567BD−01

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X

DIM

A

MIN

MAX

0.60

MILLIMETERS

A1

D

1.80 BSC

E

b

0.34

0.39

e

0.65 BSC

0.69

D

E

A B

PIN A1

REFERENCE

e

A

0.05

B

C

0.03 C

0.05 C

6X

b

12

3

B

A

0.05 C

A

A1

A2

C

0.23

0.29

1.15 BSC

0.05 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

e

A2

0.38 REF

PITCH

0.25

6X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.65

0.65

RECOMMENDED

A1

PACKAGE

OUTLINE

PITCH