PACDN1404

http://onsemi.com

3

APPLICATION INFORMATION

Parameter

Value

Pad Size on PCB

0.240 mm

Pad Shape

Round

Pad Definition

Non−Solder Mask Defined Pads

Solder Mask Opening

0.290 mm Round

Solder Stencil Thickness

0.125 mm − 0.150 mm

Solder Stencil Aperture Opening (Laser Cut, 5% Tapered Walls)

0.300 mm Round

Solder Flux Ratio

50/50 by Volume

Solder Paste Type

No Clean

Pad Protective Finish

OSP (Entek Cu Plus 106A)

Tolerance − Edge To Corner Ball

50

mm

Solder Ball Side Coplanarity

20

mm

Maximum Dwell Time Above Liquidous (183C)

60 seconds

Maximum Soldering Temperature for Lead−free Devices Using a Lead−free Solder Paste

260C

Figure 1. Recommended Non−Solder Mask Defined Pad Illustration

Non−Solder Mask Defined Pad

0.240 mm DIA.

Solder Stencil Opening

0.300 mm DIA.

Solder Mask Opening

0.290 mm DIA.

Figure 2. Lead−free (SnAgCu) Solder Ball Reflow Profile

200

250

150

100

50

0

1:00.0

2:00.0

3:00.0

4:00.0

Time (minutes)