Example of Land

Pattern Design

4

5

When designing P.C.B, the shape and size of the solder lands must allow for the proper amount of solder under the resistor.

The amount of solder at the end terminations has a direct effect on the probability that the chip will crack.

The greater amount of solder, the amount of stress on the chip, and the more likely that it will break.

Use the following illustrations as guidelines for proper ‘solder lands design’.

Type

A

B

2A+B

C

1005

1608

2012

3216

3225

5025

6432

0.7

0.9

1.0

1.4

1.4

1.5

1.5

0.5

0.8

1.4

1.8

1.8

3.3

4.6

1.9

2.6

3.4

4.6

4.6

6.3

7.6

0.5

0.8

1.3

1.6

2.6

2.5

3.2

(UNIT: mm)

Type

A

B

2A+B

C

0402

0603

1005

1608

2012

3216

3225

5025

6432

0.17

0.37

0.6

0.8

0.9

1.3

1.3

1.4

1.4

0.20

0.28

0.5

0.8

1.4

1.8

1.8

3.3

4.6

0.54

1.02

1.7

2.4

3.2

4.4

4.4

6.1

7.4

0.18

0.29

0.5

0.8

1.2

1.5

2.4

2.4

3.0

(UNIT: mm)

Type

A

B

C

D

E

062P

064P

10AT

102P

104P

164P

0.20

0.20

0.4

0.4

0.7

0.7

0.20

0.20

0.4

0.4

0.3

0.5

0.30

0.20

0.25

0.25

0.2

0.3

0.30

0.30

0.5

0.5

0.5

0.9

0.30

0.30

0.5

0.5

0.5

0.8

0.6

0.5

0.65

0.65

0.55

0.9

-

0.5

-

0.5

0.8

(UNIT: mm)

A

B

A

C

: Land Pattern

: Chip Resistor

: Land Pattern

: Chip Resistor

A

P

B

C

D

E

•Convex type

•Flow soldering

•Reflow soldering

Type

A

B

2A+B

C

1005

1608

2012

3216

5025

6432

0.8

0.8

0.9

1.7

2.15

2.3

0.5

0.5

0.8

1.2

1.8

3.0

2.1

2.1

2.6

4.6

6.1

7.6

0.5

0.8

1.2

1.4

2.6

3.3

(UNIT: mm)

•This is the recommended land pattern for designing PCB.

This pattern does not guarantee any characteristic of other product.

AB

C

D

E

•Concave type

Example of Land Pattern Design

For Chip Type

For Array Type

Type

A

B

C

D

E

P

102P

104P

0.3

0.3

0.3

0.3

0.2

0.2

0.5

0.5

0.4

0.4

0.5

0.5

(UNIT: mm)

The specifications and designs contained herein may be subject to change without notice.

Please contact our sales representatives or product engineers before order.

Operation

Notes

Example of land

Pattern Design

Recommended

Soldering Conditions

General Structure

General

Precision

Jumper

Low ohms

(RC Series)

Low ohms

(RUT Series)

Ultra Low Ohms

(RU Series)

Ultra Low Ohms

(RUK Series)

Ultra Low Ohms

(RUW Series)

Arrays

(CONVEX Type)

Arrays

(CONCAVE Type)

Arrays

(FLAT Type)

Arrays for

Memory Modules

Attenuator

Characteristics

Performance

Packaging

Standard

Resistance Value