RC2012 datasheet(35/40 Pages) SAMSUNG

35 / 40 page

Temperature

Cycle

Less than ±(1%+0.1

Ω) of the initial value.

Less than ±(3%+0.1

Ω) of the initial value.

Less than ±(3%+0.1

Ω) of the initial value.

Less than ±(3%+0.1

Ω) of the initial value.

Less than ±(3%+0.1

Ω) of the initial value.

No evidence of mechanical damage.

Load Life

Low Temp.

Exposure

High Temp.

Exposure

Moisture

Resistance

ΔR

Visual

50m

ΩMax.

50m

ΩMax.

50m

ΩMax.

50m

ΩMax.

50m

ΩMax.

JIS C 5201-1 4.19

Perform 100 cycles as follows.

Test Condition: -55

℃/ 30min ↔ 125℃/ 30min

sweep time: 5 min

Test board: <FIG. 1>

JIS C 5201-1 4.25

Test Voltage: rated voltage

Test temp.: 70±2

℃

Time: 1,000+48 hours(90 min; ON, 30 min; OFF)

Test board: <FIG. 1>

JIS C 5201-1 4.23

Dwell in -55

℃ chamber without loading for 1,000+48 hours.

Stabilize for 60 minutes at room temperature.

Measure value.

Test board: <FIG. 1>

JIS C 5201-1 4.23

Dwell in 125

℃±2℃ or 155℃±2℃chamber without

loading for 1,000+48 hours. Stabilize for 60 minutes at room

temperature.

Measure value.

Test board: <FIG. 1>

JIS C 5201-1 4.14

Test Voltage: rated voltage

Test temp.: 40±2

℃

Time: 1,000+48 hours(90 min; ON, 30 min; OFF)

Humidity: 90~95% RH

Stabilize for 1 hrs & Measure.

Test board: <FIG. 1>

Item

Requirements Specification

Test Methods

Resistor

Jumper

※These characteristics apply to 1

Ω~10MΩ. In case of other resistance range, please contact us.

※The next is specification in our company for flow soldering and test boards.

Time: 5~10 sec.

Time: 10 sec max.

Temp.: 260

±5℃.

Flux

Solder

Item

Specification

Dipping

ROSIN 25%, IPA 75%

Sn-3.0Ag-0.5Cu

Environmental Characteristic

Flow soldering Conditions

The specifications and designs contained herein may be subject to change without notice.

Please contact our sales representatives or product engineers before order.

Operation

Notes

Example of land

Pattern Design

Recommended

Soldering Conditions

General Structure

General

Precision

Jumper

Low ohms

(RC Series)

Low ohms

(RUT Series)

Ultra Low Ohms

(RU Series)

Ultra Low Ohms

(RUK Series)

Ultra Low Ohms

(RUW Series)

Arrays

(CONVEX Type)

Arrays

(CONCAVE Type)

Arrays

(FLAT Type)

Arrays for

Memory Modules

Attenuator

Characteristics

Performance

Packaging

Standard

Resistance Value

RC2012 bảng dữ liệu(PDF) 35 Page - Samsung semiconductor

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