TLV1117CDCY datasheet(5/36 Pages) TI1

5 / 36 page

TLV1117

www.ti.com

SLVS561K – DECEMBER 2004 – REVISED APRIL 2013

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN

Continuous input voltage

Operating virtual-junction temperature

150

°C

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

TLV1117

PowerFlex

THERMAL METRIC(1)(2)(3)

UNITS

KTE

KTP

DRJ

DCY

KVU

KCS/KCT

KTT

(3 PINS)

(8 PINS)

(4 PINS)

(3 PINS)

θJA

Junction-to-ambient thermal resistance

38.6

49.2

38.3

104.3

50.9

30.1

27.5

θJCtop

Junction-to-case (top) thermal

34.7

60.6

36.5

53.7

57.9

44.6

43.2

resistance

θJB

Junction-to-board thermal resistance

3.2

3.1

60.5

5.7

34.8

1.2

17.3

ψJT

Junction-to-top characterization

5.9

8.7

0.2

3.1

2.8

parameter

°C/W

Junction-to-board characterization

ψJB

3.1

5.5

23.7

1.2

9.3

parameter

Junction-to-case (bottom) thermal

θJCbot

4.7

n/a

0.4

0.3

resistance

Thermal resistance between the die

θJP

junction and the bottom of the exposed

2.7

1.4

1.78

n/a

1.94

pad.

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.

(3)

Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.

RECOMMENDED OPERATING CONDITIONS

MIN(1)

MAX

UNIT

TLV1117

2.7

TLV1117-15

2.9

TLV1117-18

3.2

VIN

Input voltage

TLV1117-25

3.9

TLV1117-33

4.7

TLV1117-50

6.4

Output current

0.8

TLV1117C

125

Operating virtual-junction temperature

°C

TLV1117I

–40

125

(1)

The input-to-output differential across the regulator should provide for some margin against regulator operation at the maximum dropout

(for a particular current value). This margin is needed to account for tolerances in both the input voltage (lower limit) and the output

voltage (upper limit). The absolute minimum VIN for a desired maximum output current can be calculated by the following:

VIN(min) = VOUT(max) + VDO(max at rated current)

Submit Documentation Feedback

Product Folder Links: TLV1117

TLV1117CDCY bảng dữ liệu(PDF) 5 Page - Texas Instruments

TLV1117CDCY bảng dữ liệu(HTML) 5 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36

bảng dữ liệu tải về

Link URL