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PIC12F508E/MS bảng dữ liệu(PDF) 45 Page - Microchip Technology

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© 2009 Microchip Technology Inc.
DS41236E-page 45
PIC12F508/509/16F505
TABLE 7-2:
CAPACITOR SELECTION FOR
CRYSTAL OSCILLATOR –
PIC12F508/509/16F505(2)
7.2.3
EXTERNAL CRYSTAL OSCILLATOR
CIRCUIT
Either a prepackaged oscillator or a simple oscillator
circuit with TTL gates can be used as an external
crystal
oscillator
circuit.
Prepackaged
oscillators
provide a wide operating range and better stability. A
well-designed crystal oscillator will provide good perfor-
mance with TTL gates. Two types of crystal oscillator
circuits can be used: one with parallel resonance, or
one with series resonance.
Figure 7-3 shows implementation of a parallel resonant
oscillator circuit. The circuit is designed to use the fun-
damental frequency of the crystal. The 74AS04 inverter
performs the 180-degree phase shift that a parallel
oscillator requires. The 4.7 k
Ω resistor provides the
negative feedback for stability. The 10 k
Ω potentiome-
ters bias the 74AS04 in the linear region. This circuit
could be used for external oscillator designs.
FIGURE 7-3:
EXTERNAL PARALLEL
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
Figure 7-4 shows a series resonant oscillator circuit.
This circuit is also designed to use the fundamental
frequency of the crystal. The inverter performs a 180-
degree phase shift in a series resonant oscillator
circuit. The 330
Ω resistors provide the negative
feedback to bias the inverters in their linear region.
FIGURE 7-4:
EXTERNAL SERIES
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
7.2.4
EXTERNAL RC OSCILLATOR
For timing insensitive applications, the RC device
option offers additional cost savings. The RC oscillator
frequency is a function of the supply voltage, the resis-
tor (REXT) and capacitor (CEXT) values, and the operat-
ing temperature. In addition to this, the oscillator
frequency will vary from unit-to-unit due to normal pro-
cess parameter variation. Furthermore, the difference
in lead frame capacitance between package types will
also affect the oscillation frequency, especially for low
CEXT values. The user also needs to take into account
variation due to tolerance of external R and C
components used.
Figure 7-5 shows
how
the
R/C combination is
connected to the PIC12F508/509/16F505 devices. For
REXT values below 3.0 k
Ω, the oscillator operation may
become unstable, or stop completely. For very high
REXT values (e.g., 1 M
Ω), the oscillator becomes
sensitive to noise, humidity and leakage. Thus, we
recommend keeping REXT between 5.0 k
Ω and
100 k
Ω.
Osc
Type
Resonator
Freq.
Cap. Range
C1
Cap. Range
C2
LP
32 kHz(1)
15 pF
15 pF
XT
200 kHz
1 MHz
4 MHz
47-68 pF
15 pF
15 pF
47-68 pF
15 pF
15 pF
HS
(3)
20 MHz
15-47 pF
15-47 pF
Note 1:
For VDD > 4.5V, C1 = C2
≈ 30 pF is
recommended.
2:
These values are for design guidance
only. Rs may be required to avoid over-
driving crystals with low drive level specifi-
cation. Since each crystal has its own
characteristics, the user should consult
the crystal manufacturer for appropriate
values of external components.
3:
PIC16F505 only.
20 pF
+5V
20 pF
10k
4.7k
10k
74AS04
XTAL
10k
74AS04
PIC16F505
CLKIN
To Other
Devices
PIC12F508
PIC12F509
330
74AS04
74AS04
PIC16F505
CLKIN
To Other
Devices
XTAL
330
74AS04
0.1 mF
PIC12F508
PIC12F509



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