BK-M datasheet(15/20 Pages) GE

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Lineage Power

Data Sheet

April 2008

36 Vdc to 75 Vdc Input; Dual Outputs; 25 W

DW025 Dual Output-Series Power Modules: dc-dc Converters;

Thermal Considerations (continued)

Air Velocity (continued)

8-988(C)

Figure 20. Total Power Dissipation vs. Local

Ambient Temperature and Air Velocity

8-989(C)

Figure 21. Case-to-Ambient Thermal Resistance vs.

Air Velocity

Use of Heat Sinks and Cold Plates

The DW025-Series case includes through-threaded

M3 x 0.5 mounting holes allowing attachment of heat

sinks or cold plates from either side of the module. The

mounting torque must not exceed 0.56 N/m (5 in.-lb.).

The following thermal model can be used to determine

the required thermal resistance of the sink to provide

the necessary cooling:

where PD is the power dissipated by the module,

θCS

represents the interfacial contact resistance between

the module and the sink, and

θSA is the sink-to-ambient

thermal impedance (°C/W). For thermal grease or foils,

a value of

θCS = 0.1 °C/W—0.3 °C/W is typical.

The required

θSA is calculated from the following equa-

tion:

θSA = [(Tc – TA)/PD] – θCS

Note that this equation assumes that all dissipated

power must be shed by the heat sink. Depending on

the user-deﬁned application environment, a more accu-

rate model including heat transfer from the sides and

bottom of the module can be used. This equation pro-

vides a conservative estimate in such instances.

For further information, refer to the

Thermal Energy

Management CC-, CW-, DC-, and DW-Series 25 W

to 30 W Board-Mounted Power Modules Technical

Note.

100

0.0

4.0

5.0

6.0

10.0

LOCAL AMBIENT TEMPERATURE, TA (

°C)

7.0

8.0

9.0

3.0

2.0

1.0

2.03 ms –1 (400 ft./min)

NATURAL

CONVECTION

1.02 ms –1 (200 ft./min)

0.51 ms –1 (100 ft./min)

0.31 ms –1 (60 ft./min)

NAT

CONV

0.25

(50)

0.51

(100)

0.76

(150)

1.78

(350)

2.03

(400)

0.0

1.0

2.0

3.0

7.0

VELOCITY ms –1 (ft./min.)

4.0

5.0

6.0

1.02

(200)

1.27

(250)

1.52

(300)

θCS

θSA

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