RB520CS30L

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 1 — 10 March 2011

3 of 14

NXP Semiconductors

RB520CS30L

[1]

[2]

[3]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[4]

Reflow soldering is the only recommended soldering method.

[5]

6.

Thermal characteristics

[1]

For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse

[2]

Reflow soldering is the only recommended soldering method.

[3]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[4]

[5]

[6]

Soldering point of cathode tab.

junction temperature

-

150

°C

ambient temperature

−65

+150

°C

storage temperature

−65

+150

°C

Table 5.

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to ambient

in free air

[1][2]

[3] -

-

395

K/W

[4] -

-

220

K/W

[5] -

-

145

K/W

thermal resistance from

junction to solder point

[6] --70

K/W