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LIS3DSHTR bảng dữ liệu(PDF) 19 Page - STMicroelectronics

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Giải thích chi tiết về linh kiện  MEMS digital output motion sensor ultra low-power high performance three-axis ?쐍ano??accelerometer
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
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LIS3DSH
Application hints
Doc ID 022405 Rev 1
19/53
4
Application hints
Figure 5.
LIS3DSH electrical connection
The device core is supplied through the Vdd line while the I/O pins are supplied through the
Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 µF) should be placed
as near as possible to pin 14 of the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to
Figure 5). It is possible to remove Vdd maintaining Vdd_IO
without blocking the communication bus, in this condition the measurement chain is
powered off.
The functionality of the device and the measured acceleration data is selectable and
accessible through the I2C or SPI interfaces. When using the I2C, CS must be tied high.
4.1
Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com.
10µF
Vdd
100nF
GND
Vdd_IO
INT1/DRDY
Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO
1
5
8
13
TOP VIEW
6
9
14
16
9
5
INT 2
NC
NC
AM10211V1



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